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LPS25HB Fiches technique(PDF) 17 Page - STMicroelectronics |
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LPS25HB Fiches technique(HTML) 17 Page - STMicroelectronics |
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17 / 40 page ![]() DocID027112 Rev 2 17/40 LPS25HB Application hints 40 5 Application hints Figure 5. LPS25HB electrical connections (top view) The device power supply must be provided through the VDD line; the power supply decoupling capacitor C1 (100 nF) must be placed as near as possible to the supply pads of the device. Depending on the application, an additional capacitor of 4.7 µF could be placed on VDD line. The functionality of the device and the measured data outputs are selectable and accessible through the I²C/SPI interface. When using the I²C, CS must be tied to Vdd_IO. All the voltage and ground supplies must be present at the same time to have proper behavior of the IC (refer to Figure 5.). It is possible to remove VDD while maintaining Vdd_IO without blocking the communication bus, in this condition the measurement chain is powered off. 5.1 Soldering information The HLGA package is compliant with the ECOPACK® standard and it is qualified for soldering heat resistance according to JEDEC J-STD-020. 10 GND 8 9 35 4 7 6 1 2 Vdd_IO SCL/SPC VDD INT_DRDY CS GND C1 GND Pin indicator |
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