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STPS3L45AF Fiches technique(PDF) 4 Page - STMicroelectronics |
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STPS3L45AF Fiches technique(HTML) 4 Page - STMicroelectronics |
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4 / 8 page ![]() Characteristics STPS3L45AF 4/8 DocID024949 Rev 2 Figure 8. Forward voltage drop versus forward current (typical values) Figure 9. Forward voltage drop versus forward current (maximum values) IF(A) 0.1 1.0 10.0 100.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 V(V) F T = 125°C j T = 25°C j 0.1 1.0 10.0 100.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 V(V) F T = 25°C j T = 125°C j IF(A) Figure 10. Thermal resistance junction to ambient versus copper surface under each lead (typical values) Figure 11. Reverse safe operating area (tp <10µs and Tj < 125 °C) Rth(j-a)(°C/W) 0 50 100 150 200 0 1 23 45 SCU(cm²) Epoxy printed board FR4, copper thickness Cu = 35 µm 0,6 0,8 1,0 1,2 1,4 1,6 45 55 65 75 85 95 Varm (V) Iarm (V) |
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