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ADS5294IPFP Fiches technique(PDF) 8 Page - Texas Instruments |
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ADS5294IPFP Fiches technique(HTML) 8 Page - Texas Instruments |
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8 / 81 page ![]() ADS5294 SLAS776D – NOVEMBER 2011 – REVISED SEPTEMBER 2015 www.ti.com 8 Specifications 8.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT AVDD –0.3 2.2 V Supply voltage LVDD –0.3 2.2 V Between AGND and LGND –0.3 0.3 V At analog inputs min[2.2, –0.3 V AVDD+0.3] At digital inputs, RESET, SCLK, SDATA, SYNC, PD, CSZ –0.3 3.6 V Voltage At CLKN, CLKP(2), min[2.2, –0.3 V AVDD+0.3] At digital outputs min[2.2, –0.3 V LVDD+0.3] Maximum junction temperature (TJ), any condition 105 °C Operating temperature –40 85 °C Storage temperature, Tstg –55 150 °C (1) Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may degrade device reliability. (2) When AVDD is turned off, TI recommends to switch off the input clock (or ensure the voltage on CLKP, CLKN is < |0.3V|). This prevents the ESD protection diodes at the clock input pins from turning on. 8.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 Electrostatic V(ESD) V discharge Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±250 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 8 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: ADS5294 |
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