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TMP103CYFFT Fiches technique(PDF) 28 Page - Texas Instruments |
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TMP103CYFFT Fiches technique(HTML) 28 Page - Texas Instruments |
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28 / 30 page ![]() www.ti.com EXAMPLE BOARD LAYOUT 4X 0.23 0.02 (0.4) TYP (0.4) TYP ( ) METAL 0.23 0.05 MAX SOLDER MASK OPENING METAL UNDER MASK ( ) SOLDER MASK OPENING 0.23 0.05 MIN 4219460/A 02/2014 DSBGA - 0.625 mm max height YFF0004 DIE SIZE BALL GRID ARRAY NOTES: (continued) 4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information, see Texas Instruments literature number SBVA017 (www.ti.com/lit/sbva017). SOLDER MASK DETAILS NOT TO SCALE SYMM SYMM LAND PATTERN EXAMPLE SCALE:50X 1 2 A B NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED |
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