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TMP103CYFFT Fiches technique(PDF) 27 Page - Texas Instruments |
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TMP103CYFFT Fiches technique(HTML) 27 Page - Texas Instruments |
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27 / 30 page ![]() www.ti.com PACKAGE OUTLINE C 0.625 MAX 0.30 0.12 0.4 TYP 0.4 TYP 4X 0.3 0.2 B E A D 4219460/A 02/2014 DSBGA - 0.625 mm max height YFF0004 DIE SIZE BALL GRID ARRAY NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. NanoFree TM package configuration. NanoFree Is a trademark of Texas Instruments. BALL A1 CORNER SEATING PLANE BALL TYP B A 1 2 0.015 C A B SYMM SYMM SCALE 13.000 D: Max = E: Max = 0.79 mm, Min = 0.79 mm, Min = 0.73 mm 0.73 mm |
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