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KAI-08050 Fiches technique(PDF) 29 Page - ON Semiconductor |
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KAI-08050 Fiches technique(HTML) 29 Page - ON Semiconductor |
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29 / 31 page ![]() KAI−08050 www.onsemi.com 29 MECHANICAL INFORMATION Completed Assembly Figure 26. Completed Assembly Notes: 1. See Ordering Information for marking code. 2. No materials to interfere with clearance through guide holes. 3. The center of the active image is nominally at the center of the package. 4. Die rotation < 0.5 degrees 5. Internal traces may be exposed on sides of package. Do not allow metal to contact sides of ceramic package. 6. Recommended mounting screws: 1.6 X 0.35 mm (ISO Standard); 0 – 80 (Unified Fine Thread Standard) 7. Units: millimeters |
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