UPD62AMC datasheet(55/62 Pages) NEC

55 / 62 page

µPD62A

Data Sheet U14474EJ1V0DS00

15. RECOMMENDED SOLDERING CONDITIONS

The

µPD62A should be soldered and mounted under the following recommended conditions.

For the details of the recommended soldering conditions, refer to the document Semiconductor Device

Mounting Technology Manual (C10535E).

For soldering methods and conditions other than those recommended below, contact your NEC sales representa-

tives.

Table 15-1. Surface Mounting Type Soldering Conditions

µPD62AMC-×××-5A4: 20-pin plastic SSOP (300 mils)

Soldering Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

Package peak temperature: 235

°C; Time: 30 seconds max. (at 210°C or higher);

IR35-00-3

Count: three times or less

VPS

Package peak temperature: 215

°C; Time: 40 seconds. max. (at 200°C or higher);

VP15-00-3

Count: Three times or less

Wave soldering

Solder bath temperature: 260

°C max.; Time: 10 seconds max.; Count: once;

WS60-00-1

Preheating temperature: 120

°C max. (package surface temperature)

Partial heating

Pin temperature: 300

°C or less; Time: 3 seconds max. (per pin row)

—

Caution Do not use different soldering methods together (except for partial heating).

UPD62AMC Fiches technique(PDF) 55 Page - NEC