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AN3115 Fiches technique(PDF) 25 Page - STMicroelectronics |
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AN3115 Fiches technique(HTML) 25 Page - STMicroelectronics |
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25 / 28 page ![]() AN3115 Layout guidelines Doc ID 16830 Rev 3 25/28 However, different layouts are also possible. Basic principles suggest keeping the IC and its ground exposed pad approximately in the middle of the dissipating area; to provide as many vias as possible; to design a dissipating area having a shape as square as possible and not interrupted by other copper traces. |
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