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M24C32-R Fiches technique(PDF) 35 Page - STMicroelectronics |
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M24C32-R Fiches technique(HTML) 35 Page - STMicroelectronics |
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35 / 42 page ![]() DocID4578 Rev 24 35/42 M24C32-W M24C32-R M24C32-F M24C32-X M24C32-DF Package mechanical data 41 Figure 17. TSSOP8 – 8-lead thin shrink small outline, package outline 1. Drawing is not to scale. Table 22. TSSOP8 – 8-lead thin shrink small outline, package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to four decimal digits. Typ. Min. Max. Typ. Min. Max. A – – 1.200 – – 0.0472 A1 – 0.050 0.150 – 0.0020 0.0059 A2 1.000 0.800 1.050 0.0394 0.0315 0.0413 b – 0.190 0.300 – 0.0075 0.0118 c – 0.090 0.200 – 0.0035 0.0079 CP – – 0.100 – – 0.0039 D 3.000 2.900 3.100 0.1181 0.1142 0.1220 e 0.650 – – 0.0256 – – E 6.400 6.200 6.600 0.2520 0.2441 0.2598 E1 4.400 4.300 4.500 0.1732 0.1693 0.1772 L 0.600 0.450 0.750 0.0236 0.0177 0.0295 L1 1.000 – – 0.0394 – – α – 0° 8° – 0° 8° |
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