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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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L6208Q Fiches technique(PDF) 28 Page - STMicroelectronics |
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L6208Q Fiches technique(HTML) 28 Page - STMicroelectronics |
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28 / 34 page  Thermal management L6208Q 28/34 DocID018710 Rev 3 8 Thermal management In most applications the power dissipation in the IC is the main factor that sets the maximum current that can be delivered by the device in a safe operating condition. Therefore, it must be considered very carefully. Besides the available space on the PCB, the right package should be chosen considering the power dissipation. Heat sinking can be achieved using copper on the PCB with proper area and thickness. Table 7. Thermal data Symbol Parameter Package Typ. Unit RthJA Thermal resistance junction-ambient VFQFPN48(1) 1. VFQFPN48 mounted on the EVAL6208Q rev 1 board (see EVAL6208Q databrief): four-layer FR4 PCB with a dissipating copper surface of about 45 cm2 on each layer and 25 via holes below the IC. 17 °C/W |
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