MPC7457 datasheet(45/71 Pages) FREESCALE

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Package Description

MPC7457 RISC Microprocessor Hardware Specifications, Rev. 8

Freescale Semiconductor

8.2

Mechanical Dimensions for the MPC7447, 360 CBGA

Figure 20 provides the mechanical dimensions and bottom surface nomenclature for the MPC7447, 360

CBGA package.

Figure 20. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC7447,

360 CBGA Package

NOTES:

1. DIMENSIONING AND

TOLERANCING PER ASME

Y14.5M, 1994.

2. DIMENSIONS IN

MILLIMETERS.

3. TOP SIDE A1 CORNER

INDEX IS A METALIZED

FEATURE WITH VARIOUS

SHAPES. BOTTOM SIDE A1

CORNER IS DESIGNATED

WITH A BALL MISSING

FROM THE ARRAY.

0.2

360X

A1 CORNER

0.2

123456789 10 111213141516

0.3

0.15

0.15 A

17 18 19

Millimeters

DIM

MIN

MAX

2.72

3.20

0.80

1.00

1.10

1.30

—

0.6

0.82

0.93

25.00 BSC

—

11.3

8.0

—

6.5

10.9

11.1

1.27 BSC

25.00 BSC

—

11.3

8.0

—

6.5

9.55

9.75

Capacitor Region

0.35 A

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