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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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MPC7457 Fiches technique(PDF) 44 Page - Freescale Semiconductor, Inc |
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MPC7457 Fiches technique(HTML) 44 Page - Freescale Semiconductor, Inc |
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44 / 71 page  MPC7457 RISC Microprocessor Hardware Specifications, Rev. 8 Package Description Freescale Semiconductor 44 8 Package Description The following sections provide the package parameters and mechanical dimensions for the CBGA package. 8.1 Package Parameters for the MPC7447, 360 CBGA The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360-lead ceramic ball grid array (CBGA). Package outline 25 × 25 mm Interconnects 360 (19 × 19 ball array – 1) Pitch 1.27 mm (50 mil) Minimum module height 2.72 mm Maximum module height3.24 mm Ball diameter 0.89 mm (35 mil) |
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