M/A-COM Products

V2

MA4SW510B-1

HMIC™ Silicon PIN Diode Switch

RoHS Compliant

with Integrated Bias Network

• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macom.com for additional data sheets and product information.

MA-COM Technical Solutions and its affiliates reserve the right to make changes to the

product(s) or information contained herein without notice.

7

ADVANCED:

Data Sheets contain information regarding a product MA-COM Technical Solutions is

considering for development. Performance is based on target specifications, simulated results, and/

or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY:

Data Sheets contain information regarding a product MA-COM Technical Solutions

has under development. Performance is based on engineering tests. Specifications are typical.

Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit-

ment to produce in volume is not guaranteed.

Cleanliness

These chips should be handled in a clean environment.

Wire Bonding

Thermosonic wedge wire bonding using 0.00025” x 0.003” ribbon or 0.001” diameter gold wire is

energy should be adjusted to the minimum required to achieve a good bond. RF bond wires should be kept as

short and straight as possible.

Mounting

The HMIC switches have Ti-Pt-Au back metal. They can be die mounted with a gold-tin eutectic solder

preform or conductive epoxy. Mounting surface must be clean and flat.

Eutectic Die Attachment

seconds should be required for attachment. Solders containing tin should not be used.

Epoxy Die Attachment

A minimum amount of epoxy should be used. A thin epoxy fillet should be visible around the perimeter of the

Wire/Ribbon and Die Attachment Recommendations

Part Number

Package

MA4SW510B-1

Waffle Pack

Ordering Information