M/A-COM Products

V2

MA4SW510B-1

HMIC™ Silicon PIN Diode Switch

RoHS Compliant

with Integrated Bias Network

• North America Tel: 800.366.2266 / Fax: 978.366.2266

• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300

• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298

Visit www.macom.com for additional data sheets and product information.

MA-COM Technical Solutions and its affiliates reserve the right to make changes to the

product(s) or information contained herein without notice.

6

ADVANCED:

Data Sheets contain information regarding a product MA-COM Technical Solutions is

considering for development. Performance is based on target specifications, simulated results, and/

or prototype measurements. Commitment to develop is not guaranteed.

PRELIMINARY:

Data Sheets contain information regarding a product MA-COM Technical Solutions

has under development. Performance is based on engineering tests. Specifications are typical.

Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commit-

ment to produce in volume is not guaranteed.

MA4SW510B-1

Chip Outline Drawing

1,2

Notes:

1.

Topside and backside metallization is gold , 2.5µM thick typical.

2.

Yellow areas indicate wire bonding pads

DIM

Mils

Millimeters

MIN

MAX

MIN

MAX

A

54

55

1.37

1.40

B

27

28

0.69

0.71

C

30

31

0.76

0.79

D

31

32

0.79

0.81

E

19

20

0.48

0.51

F

118.5

120.5

3.01

3.06

G

35

36

0.89

0.91

RF Bond Pads (J1-J6)

7 X 5 REF.

.178 X .127 REF.

DC Bond Pads (B2-B6)

5 X 5 REF.

.127 X .127 REF.

Chip Thickness

5 REF.

0.127 REF.