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L6235N Fiches technique(PDF) 28 Page - STMicroelectronics |
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L6235N Fiches technique(HTML) 28 Page - STMicroelectronics |
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28 / 35 page ![]() Application information L6235 28/35 DocID7618 Rev 2 Figure 27. SO24 junction ambient thermal resistance versus on-board copper area Figure 28. Mounting the PowerSO package Slug soldered to PCB with dissipating area Slug soldered to PCB with dissipating area plus ground layer Slug soldered to PCB with dissipating area plus ground layer contacted through via holes |
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