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L6235N Fiches technique(PDF) 26 Page - STMicroelectronics |
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L6235N Fiches technique(HTML) 26 Page - STMicroelectronics |
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26 / 35 page ![]() Application information L6235 26/35 DocID7618 Rev 2 Figure 23. Typical application 11.1 Output current capability and IC power dissipation In Figure 24 is shown the approximate relation between the output current and the IC power dissipation using PWM current control. For a given output current the power dissipated by the IC can be easily evaluated, in order to establish which package should be used and how large must be the on-board copper dissipating area to guarantee a safe operating junction temperature (125 °C maximum). Figure 24. IC power dissipation versus output power |
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