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PCF8583 Fiches technique(PDF) 27 Page - NXP Semiconductors |
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PCF8583 Fiches technique(HTML) 27 Page - NXP Semiconductors |
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27 / 37 page ![]() PCF8583 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 06 — 6 October 2010 27 of 37 NXP Semiconductors PCF8583 Clock and calendar with 240 x 8-bit RAM Fig 25. Package outline SOT176-1 (SO8) of PCF8583T UNIT A max. A1 A2 A3 bp cD(1) E(1) Z (1) eHE LLp Qy w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches 2.65 0.3 0.1 2.45 2.25 0.49 0.36 0.32 0.23 7.65 7.45 7.6 7.4 1.27 10.65 10.00 1.1 1.0 2.0 1.8 8 0 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.1 0.45 SOT176-1 97-05-22 03-02-19 X 4 8 θ A A1 A2 w M bp D HE L p Q detail X E Z e c L v M A 5 1 (A ) 3 A y 0.25 0.1 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.30 0.29 0.30 0.29 0.05 1.45 0.057 0.25 0.01 0.419 0.394 0.043 0.039 0.079 0.071 0.01 0.004 0.043 0.018 0.01 0 5 10 mm scale pin 1 index SO8: plastic small outline package; 8 leads; body width 7.5 mm SOT176-1 |
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