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PCF8583 Fiches technique(PDF) 26 Page - NXP Semiconductors |
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PCF8583 Fiches technique(HTML) 26 Page - NXP Semiconductors |
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26 / 37 page ![]() PCF8583 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 06 — 6 October 2010 26 of 37 NXP Semiconductors PCF8583 Clock and calendar with 240 x 8-bit RAM 12. Package outline Fig 24. Package outline SOT97-1 (DIP8) of PCF8583P REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT97-1 99-12-27 03-02-13 UNIT A max. 12 b1 (1) (1) (1) b2 cD E e M Z H L mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) A min. A max. b max. w M E e 1 1.73 1.14 0.53 0.38 0.36 0.23 9.8 9.2 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 1.15 4.2 0.51 3.2 inches 0.068 0.045 0.021 0.015 0.014 0.009 1.07 0.89 0.042 0.035 0.39 0.36 0.26 0.24 0.14 0.12 0.01 0.1 0.3 0.32 0.31 0.39 0.33 0.045 0.17 0.02 0.13 b2 050G01 MO-001 SC-504-8 MH c (e ) 1 ME A L A1 w M b1 e D A2 Z 8 1 5 4 b E 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. pin 1 index DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 |
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