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SSM2356 Fiches technique(PDF) 14 Page - Analog Devices |
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SSM2356 Fiches technique(HTML) 14 Page - Analog Devices |
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14 / 16 page ![]() SSM2356 Data Sheet Rev. A | Page 14 of 16 The measurements for Figure 36 and Figure 37 were taken in an FCC-certified EMI laboratory with a 1 kHz input signal, producing 0.5 W output power into an 8 Ω load from a 5 V supply. Cable length was 12 cm, unshielded twisted pair speaker cable. Note that reducing the supply voltage greatly reduces radiated emissions. OUTPUT MODULATION DESCRIPTION The SSM2356 uses three-level, Σ-Δ output modulation. Each output can swing from GND to VDD and vice versa. Ideally, when no input signal is present, the output differential voltage is 0 V because there is no need to generate a pulse. In a real-world situation, there are always noise sources present. Due to this constant presence of noise, a differential pulse is generated, when required, in response to this stimulus. A small amount of current flows into the inductive load when the differ- ential pulse is generated. However, most of the time, output differential voltage is 0 V, due to the Analog Devices three-level, Σ-Δ output modulation. This feature ensures that the current flowing through the inductive load is small. When the user wants to send an input signal, an output pulse is generated to follow input voltage. The differential pulse density is increased by raising the input signal level. Figure 38 depicts three-level, Σ-Δ output modulation with and without input stimulus. OUTPUT > 0V +5V 0V OUT+ +5V 0V OUT– +5V 0V VOUT OUTPUT < 0V +5V 0V OUT+ +5V 0V OUT– 0V –5V VOUT OUTPUT = 0V OUT+ +5V 0V +5V 0V OUT– +5V –5V 0V VOUT Figure 38. Three-Level, Σ-Δ Output Modulation With and Without Input Stimulus LAYOUT As output power continues to increase, care must be taken to lay out PCB traces and wires properly among the amplifier, load, and power supply. A good practice is to use short, wide PCB tracks to decrease voltage drops and minimize inductance. Ensure that track widths are at least 200 mil for every inch of track length for the lowest dc resistance (DCR), and use 1 oz. or 2 oz. copper PCB traces to further reduce IR drops and inductance. A poor layout increases voltage drops, consequently affecting efficiency. Use large traces for the power supply inputs and amplifier outputs to minimize losses due to parasitic trace resistance. Proper grounding guidelines help to improve audio performance, minimize crosstalk between channels, and prevent switching noise from coupling into the audio signal. To maintain high output swing and high peak output power, the PCB traces that connect the output pins to the load and supply pins should be as wide as possible to maintain the minimum trace resistances. It is also recommended that a large ground plane be used for minimum impedances. In addition, good PCB layout isolates critical analog paths from sources of high inter- ference. High frequency circuits (analog and digital) should be separated from low frequency circuits. Properly designed multilayer PCBs can reduce EMI emission and increase immunity to the RF field by a factor of 10 or more, compared with double-sided boards. A multilayer board allows a complete layer to be used for the ground plane, whereas the ground plane side of a double-sided board is often disrupted by signal crossover. If the system has separate analog and digital ground and power planes, the analog ground plane should be directly beneath the analog power plane, and, similarly, the digital ground plane should be directly beneath the digital power plane. There should be no overlap between analog and digital ground planes or between analog and digital power planes. INPUT CAPACITOR SELECTION The SSM2356 does not require input coupling capacitors if the input signal is biased from 1.0 V to VDD − 1.0 V. Input capacitors are required if the input signal is not biased within this recom- mended input dc common-mode voltage range, if high-pass filtering is needed, or if a single-ended source is used. If high- pass filtering is needed at the input, the input capacitor and the input resistor of the SSM2356 form a high-pass filter whose corner frequency is determined by the following equation: fC = 1/(2π × RIN × CIN) The input capacitor can significantly affect the performance of the circuit. Not using input capacitors degrades both the output offset of the amplifier and the dc PSRR performance. PROPER POWER SUPPLY DECOUPLING To ensure high efficiency, low total harmonic distortion (THD), and high PSRR, proper power supply decoupling is necessary. Noise transients on the power supply lines are short-duration voltage spikes. These spikes can contain frequency components that extend into the hundreds of megahertz. The power supply input must be decoupled with a good quality, low ESL, low ESR capacitor, greater than 4.7 μF. This capacitor bypasses low freq- uency noises to the ground plane. For high frequency transient noises, use a 0.1 μF capacitor as close as possible to the VDD pin of the device. Placing the decoupling capacitor as close as possible to the SSM2356 helps to maintain efficient performance. |
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