AS1364

Datasheet - Absolute Maximum Rat i ngs

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Revision 1.8

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5 Absolute Maximum Ratings

Stresses beyond those listed in Table 3 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 3. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

Electrical Parameters

IN, EN, POK to GND

-0.3

+7

V

OUT, SET/BYP to GND

-0.3

V

Output Short-Circuit Duration

Infinite

Latch-Up

-100

+100

mA

JEDEC 78

Electrostatic Discharge

ESD

2

kV

HBM MIL-Std. 883E 3015.7 methods

Temperature Ranges and Storage Conditions

Thermal Resistance

36.3

ºC/W

on PCB

Operating Temperature Range

-40

+85

ºC

Storage Temperature Range

-65

+150

ºC

Junction Temperature

+125

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body temperature)

specified is in accordance with IPC/JEDEC J-STD-020

“Moisture/Reflow Sensitivity Classification for Non-

Hermetic Solid State Surface Mount Devices”.

The lead finish for Pb-free leaded packages is matte tin

(100% Sn).