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RC2012 Fiches technique(PDF) 28 Page - Samsung semiconductor |
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RC2012 Fiches technique(HTML) 28 Page - Samsung semiconductor |
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28 / 40 page ![]() Arrays(Flat Type) RF062P RF064P Type 0.80±0.05 1.40±0.05 0.60±0.05 0.60±0.05 0.23±0.10 0.23±0.10 0.20±0.10 0.20±0.10 0.10±0.10 0.10±0.10 0.20±0.10 0.20±0.10 0.50±0.05 0.40±0.05 0.3 ㎎ 0.5 ㎎ L W TA B G P Average Weight (UNIT: mm) •2 Array •4 Array •Reducing SMD surface area (40% reduced). •Reducing SMD costs (75% reduced). •Both flow and reflow soldering are applicable. •Convex & concave type. The product of lead-free terminal is RoHS compliant. PhO(lead oxide) is included in the glass of our product which is prescribed on RoHS appendix as an exception. •For semiconductor devices. •For computers, digital circuits. Feature Application Structure and Dimensions RF: Flat type array RF Code Designation 06: 0603 06 Dimension 2P: 2 Pieces 4P: 4 Pieces 4P Resistors J: ±5% ※Jumper: ’ J ’ J Tolerance 3 digit coding system (IEC coding system) E-24 series R68 Resistance Value CS : Tape Packaging 7" ES : Tape Packaging 10" AS : Tape Packaging 13" CS Packaging Code •The part number system shall be in the following format Parts Numbering System <Top side> <Bottom View> L G P L PA A T T W G W B B |
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