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SL40307A-R19KHF Fiches technique(PDF) 49 Page - International Rectifier |
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SL40307A-R19KHF Fiches technique(HTML) 49 Page - International Rectifier |
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49 / 53 page ![]() IR3846 49 www.irf.com © 2013 International Rectifier August 01, 2013 STENCIL DESIGN Stencils for PQFN can be used with thicknesses of 0.100-0.250mm (0.004-0.010"). Stencils thinner than 0.100mm are unsuitable because they deposit insufficient solder paste to make good solder joints with the ground pad; high reductions sometimes create similar problems. Stencils in the range of 0.125mm-0.200mm (0.005-0.008"), with suitable reductions, give the best results. Evaluations have shown that the best overall performance is achieved using the stencil design shown in following figure. This design is for a stencil thickness of 0.127mm (0.005"). The reduction should be adjusted for stencils of other thicknesses. SOLDER PASTE STENCIL PAD SIZES |
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