Moteur de recherche de fiches techniques de composants électroniques
  French  ▼
ALLDATASHEET.FR

X  

SL40307A-R19KHF Fiches technique(PDF) 48 Page - International Rectifier

No de pièce SL40307A-R19KHF
Description  Single-Input Voltage, Synchronous Buck Regulator
PDF  53 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Fabricant  IRF [International Rectifier]
Site Internet  http://www.irf.com
Logo IRF - International Rectifier

SL40307A-R19KHF Fiches technique(HTML) 48 Page - International Rectifier

Back Button SL40307A-R19KHF Datasheet HTML 44Page - International Rectifier SL40307A-R19KHF Datasheet HTML 45Page - International Rectifier SL40307A-R19KHF Datasheet HTML 46Page - International Rectifier SL40307A-R19KHF Datasheet HTML 47Page - International Rectifier SL40307A-R19KHF Datasheet HTML 48Page - International Rectifier SL40307A-R19KHF Datasheet HTML 49Page - International Rectifier SL40307A-R19KHF Datasheet HTML 50Page - International Rectifier SL40307A-R19KHF Datasheet HTML 51Page - International Rectifier SL40307A-R19KHF Datasheet HTML 52Page - International Rectifier Next Button
Zoom Inzoom in Zoom Outzoom out
 48 / 53 page
background image
IR3846
48 www.irf.com
© 2013 International Rectifier
August 01, 2013
SOLDER RESIST
IR recommends that the larger Power or Land
Area pads are Solder Mask Defined (SMD).
This allows the underlying Copper traces to be
as large as possible, which helps in terms of
current carrying capability and device cooling
capability.
When using SMD pads, the underlying copper
traces should be at least 0.05mm larger (on
each edge) than the Solder Mask window, in
order to accommodate any layer to layer
misalignment. (i.e. 0.1mm in X & Y).
However, for the smaller Signal type leads
around the edge of the device, IR recommends
that these are Non Solder Mask Defined or
Copper Defined.
When using NSMD pads, the Solder Resist
Window should be larger than the Copper Pad
by at least 0.025mm on each edge, (i.e.
0.05mm in X & Y), in order to accommodate any
layer to layer misalignment.
Ensure that the solder resist in-between the
smaller signal lead areas are at least 0.15mm
wide, due to the high x/y aspect ratio of the
solder mask strip.
PAD SIZES
PAD SPACING



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53


Fiches technique Télécharger

Go To PDF Page


Lien URL



ALLDATASHEET vous a-t-il été utile ?  [ DONATE ] 

À propos de Alldatasheet   |   Publicité   |   Contactez-nous   |   Politique de confidentialité   |   Lien vers la fiche technique    |   Echange de liens   |   Fabricants
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com