STM32L151VBT6DTR datasheet(94/121 Pages) STMICROELECTRONICS

No de pièce	STM32L151VBT6DTR

Description	Ultra-low-power 32-bit MCU ARM-based Cortex-M3

PDF	121 Pages

Scroll/Zoom	100%

Fabricant	STMICROELECTRONICS [STMicroelectronics]

Site Internet	http://www.st.com

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94 / 121 page

Electrical characteristics

STM32L151x6/8/B, STM32L152x6/8/B

94/121

Doc ID 17659 Rev 8

Figure 27.

Maximum dynamic current consumption on VREF+ supply pin during ADC

conversion

General PCB design guidelines

Power supply decoupling should be performed as shown in Figure 28 or Figure 29,

depending on whether VREF+ is connected to VDDA or not. The 10 nF capacitors should be

ceramic (good quality). They should be placed as close as possible to the chip.

ADC clock

Sampling (n cycles)

Conversion (12 cycles)

Iref+

300µA

700µA

Table 56.

RAIN max for fADC = 16 MHz

(1)

(cycles)

(µs)

RAIN max (kohm)

Multiplexed channels

Direct channels

2.4 V < VDDA < 3.6 V 1.8 V < VDDA < 2.4 V 2.4 V < VDDA < 3.3 V 1.8 V < VDDA < 2.4 V

0.25

Not allowed

0.7

Not allowed

0.5625

0.8

Not allowed

2.0

1.0

2.0

0.8

4.0

3.0

1.5

3.0

1.8

6.0

4.5

6.8

4.0

15.0

10.0

15.0

10.0

30.0

20.0

192

32.0

25.0

50.0

40.0

384

50.0

Guaranteed by design, not tested in production.

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