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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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STBLC01QTR Fiches technique(PDF) 29 Page - STMicroelectronics |
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STBLC01QTR Fiches technique(HTML) 29 Page - STMicroelectronics |
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29 / 40 page  DocID022984 Rev 2 29/40 STLBC01 Application design guidelines 8.3 Power supplies In order to avoid any interference on the RF communication, all STBLC01 power supplies need to be properly decoupled. In general, all decoupling capacitors defined in Figure 4 need to be as close as possible to the relative pin. Special caution needs to be taken for the decoupling on AVDD_PA (power supply for PA) and VDD (power supply for digital part). It is mandatory to put the decoupling capacitors as close as possible to the pin. All ground connections must be as short as possible using vias directly to the ground plane. Avoid sharing vias between different signals. |
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