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ADP122ACPZ-2.6-R7 Fiches technique(PDF) 19 Page - Analog Devices |
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ADP122ACPZ-2.6-R7 Fiches technique(HTML) 19 Page - Analog Devices |
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19 / 24 page ![]() Data Sheet ADP122/ADP123 Rev. E | Page 19 of 24 PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS Heat dissipation from the package can be improved by increasing the amount of copper attached to the pins of the ADP122/ADP123. However, as shown in Table 6, a point of diminishing returns eventually is reached, beyond which an increase in the copper size does not yield significant heat dissipation benefits. The input capacitor should be placed as close as possible to the VIN and GND pins, and the output capacitor should be placed as close as possible to the VOUT and GND pins. Use of 0402 or 0603 size capacitors and resistors achieves the smallest possible footprint solution on boards where the area is limited. Figure 52. Example ADP122 PCB Layout Figure 53. Example ADP123 PCB Layout |
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