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ADP122ACPZ-2.6-R7 Fiches technique(PDF) 18 Page - Analog Devices |
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ADP122ACPZ-2.6-R7 Fiches technique(HTML) 18 Page - Analog Devices |
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18 / 24 page ![]() ADP122/ADP123 Data Sheet Rev. E | Page 18 of 24 150mA 0 20 40 60 80 100 120 140 0.5 1.0 1.5 2.0 2.5 3.0 VOUT – VIN (V) TJ MAX 25mA 100mA 300mA 1mA 10mA Figure 49. Junction Temperature vs. Power Dissipation, 0 mm2 of PCB Copper, TA = 25°C 0 20 40 60 80 100 120 140 0.5 1.0 1.5 2.0 2.5 3.0 VOUT – VIN (V) TJ MAX 25mA 100mA 150mA 300mA 1mA 10mA Figure 50. Junction Temperature vs. Power Dissipation, 0 mm2 of PCB Copper, TA = 50°C 0 20 40 60 80 100 120 140 0.4 0.8 1.2 1.6 2.0 2.4 2.8 VOUT – VIN (V) 25mA 100mA 150mA 300mA TJ MAX 1mA 10mA Figure 51. Junction Temperature vs. Power Dissipation, Board Temperature = 85°C |
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