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MPC8260EC Fiches technique(PDF) 38 Page - Freescale Semiconductor, Inc |
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MPC8260EC Fiches technique(HTML) 38 Page - Freescale Semiconductor, Inc |
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38 / 41 page ![]() MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2 38 Freescale Semiconductor Package Description 5.2 Mechanical Dimensions Figure 15 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA package. Figure 15. Mechanical Dimensions and Bottom Surface Nomenclature Dim Millimeters Min Max A 1.45 1.65 A1 0.60 0.70 A2 0.85 0.95 A3 0.25 — b 0.65 0.85 D 37.50 BSC D1 35.56 REF e1.27 BSC E 37.50 BSC E1 35.56 REF Notes: 1. Dimensions and Tolerancing per ASME Y14.5M-1994. 2. Dimensions in millimeters. 3. Dimension b is measured at the maximum solder ball diameter, parallel to primary data A. |
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