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MPL115A2 Fiches technique(PDF) 12 Page - Freescale Semiconductor, Inc |
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MPL115A2 Fiches technique(HTML) 12 Page - Freescale Semiconductor, Inc |
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12 / 16 page ![]() Sensors 12 Freescale Semiconductor, Inc. MPL115A2 5 Handling Recommendations It is recommended to handle the MPL115A pressure sensor with a vacuum pick and place tool. Sharp objects utilized to move the MPL115A pressure sensor increase the possibility of damage via a foreign object/tool into the small exposed port. The sensor die is sensitive to light exposure. Direct light exposure through the port hole can lead to varied accuracy of pressure measurement. Avoid such exposure to the port during normal operation. Please note that the Pin 1 designator is on the bottom of the package. Do not use the port as a orientation reference in production. 6 Soldering/Landing Pad Information The LGA package is compliant with the RoHS standard. It is recommended to use a no-clean solder paste to reduce cleaning exposure to high pressure and chemical agents that can damage or reduce life span of the Pressure sensing element. Figure 6. MPL115A2 Recommended PCB Landing Pattern |
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