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M24C08-125 Fiches technique(PDF) 27 Page - STMicroelectronics |
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M24C08-125 Fiches technique(HTML) 27 Page - STMicroelectronics |
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27 / 30 page ![]() M24C16-125 M24C08-125 M24C04-125 M24C02-125 Package mechanical data Doc ID 022564 Rev 1 27/30 Figure 13. TSSOP8 – 8 lead thin shrink small outline, package outline 1. Drawing is not to scale. 2. The circle in the top view of the package indicates the position of pin 1. Table 12. TSSOP8 – 8 lead thin shrink small outline, package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Typ. Min. Max. Typ. Min. Max. A - - 1.200 - - 0.0472 A1 - 0.050 0.150 - 0.0020 0.0059 A2 1.000 0.800 1.050 0.0394 0.0315 0.0413 b - 0.190 0.300 - 0.0075 0.0118 c - 0.090 0.200 - 0.0035 0.0079 CP - - 0.100 - - 0.0039 D 3.000 2.900 3.100 0.1181 0.1142 0.1220 e 0.650 - - 0.0256 - - E 6.400 6.200 6.600 0.2520 0.2441 0.2598 E1 4.400 4.300 4.500 0.1732 0.1693 0.1772 L 0.600 0.450 0.750 0.0236 0.0177 0.0295 L1 1.000 - - 0.0394 - - α -0° 8°- 0° 8° TSSOP8AM 1 8 CP c L E E1 D A2 A α e b 4 5 A1 L1 |
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