STPS2150

Characteristics

5/9

Figure 17.

Thermal resistance versus lead length (DO-15)

Figure 13.

Forward voltage drop versus

forward current (maximum values,

low level)

Figure 14.

Forward voltage drop versus

forward current (maximum values,

high level)

I

(A)

FM

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

0.0

0.2

0.4

0.6

0.8

1.0

1.2

T

(Maximum values)

T

(Maximum values)

T

(Maximum values)

T

(Typical values)

T

(Typical values)

V

(V)

FM

I

(A)

FM

1

10

100

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

V

(V)

FM

T =25°C

(maximum values)

j

T =125°C

(maximum values)

j

T =125°C

(typical values)

j

Figure 15.

Thermal resistance junction to

ambient versus copper surface

under each lead - epoxy printed

circuit board FR4, copper

thickness = 35 µm (SMA)

Figure 16.

Thermal resistance junction to

ambient versus copper surface

under each lead - epoxy printed

circuit board FR4, copper

thickness = 35 µm (SMAflat)

R

(°C/W)

th(j-a)

0

20

40

60

80

100

120

140

012

345

SMA

S (cm²)

Cu

0

20

40

60

80

100

120

140

160

180

200

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0

SMAflat

R

(°C/W)

th(j-a)

S (cm²)

Cu

R (°C/W)

th

0

20

40

60

80

100

120

5

10152025

L

(mm)

leads