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STPS2150 Fiches technique(PDF) 6 Page - STMicroelectronics |
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STPS2150 Fiches technique(HTML) 6 Page - STMicroelectronics |
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6 / 9 page ![]() Package information STPS2150 6/9 2 Package information ● Epoxy meets UL94, V0. In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Table 5. SMA package dimensions REF. Dimensions Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.094 A2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 D 2.25 2.90 0.089 0.114 E 4.80 5.35 0.189 0.211 E1 3.95 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 Figure 18. SMA footprint dimensions in millimeters (inches) Figure 19. Marking information E C L E1 D A1 A2 b 2.63 (0.103) 5.43 (0.214) 1.4 1.64 (0.064) 1.4 (0.055) (0.055) y w w e3 z x x x e3: ECOPACK ( Leadfree) XXX: Marking Z: Manufacturing location Y: Year WW: week Cathode bar (unidirectional devices only ) |
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