ST7580 datasheet(30/33 Pages) STMICROELECTRONICS

No de pièce	ST7580

Description	FSK, PSK multi-mode power line networking system-on-chip

PDF	33 Pages

Scroll/Zoom	100%

Fabricant	STMICROELECTRONICS [STMicroelectronics]

Site Internet	http://www.st.com

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30 / 33 page

Package mechanical data

ST7580

30/33

Doc ID 022644 Rev 1

Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK

specifications, grade definitions and product status are available at: www.st.com. ECOPACK

is an ST trademark.

The ST7580 is hosted in a 48-pin thermally enhanced, very thin, fine pitch quad flat package

no lead (VFQFPN) with exposed pad, which allows the device to dissipate the heat that is

generated by the operation of the two linear regulators and the power amplifier.

Table 13.

VFQFPN48 (7 x 7 x 1.0 mm) package mechanical data

Dim.

(mm)

Min.

Typ.

Max.

0.80

0.90

1.00

0.02

0.05

0.65

1.00

0.25

0.18

0.23

0.30

6.85

7.00

7.15

4.95

5.10

5.25

6.85

7.00

7.15

4.95

5.10

5.25

0.45

0.50

0.55

0.30

0.40

0.50

ddd

0.08

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