ST7570 datasheet(23/26 Pages) STMICROELECTRONICS

No de pièce	ST7570

Description	S-FSK power line networking system-on-chip

PDF	26 Pages

Scroll/Zoom	100%

Fabricant	STMICROELECTRONICS [STMicroelectronics]

Site Internet	http://www.st.com

Logo

23 / 26 page

ST7570

Package mechanical data

Doc ID 17526 Rev 2

23/26

Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

The ST7570 is hosted in a 48 pin thermally enhanced very thin fine pitch quad flat package

no lead (VFQFPN) with exposed pad, which allows the device dissipating the heat that is

generated by the operation of the two linear regulators and the power amplifier.

A mechanical drawing of the VFQFPN48 package is included in Figure 15.

Table 9.

VFQFPN48 (7 x 7 x 1.0 mm) package mechanical data

Dim.

(mm)

Min.

Typ.

Max.

0.80

0.90

1.00

0.02

0.05

0.65

1.00

0.25

0.18

0.23

0.30

6.85

7.00

7.15

4.95

5.10

5.25

6.85

7.00

7.15

4.95

5.10

5.25

0.45

0.50

0.55

0.30

0.40

0.50

ddd

0.08

ST7570 Fiches technique(PDF) 23 Page - STMicroelectronics

ST7570 Fiches technique(HTML) 23 Page - STMicroelectronics

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26

Fiches technique Télécharger

Lien URL