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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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SL3ICS1202 Fiches technique(PDF) 16 Page - NXP Semiconductors |
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SL3ICS1202 Fiches technique(HTML) 16 Page - NXP Semiconductors |
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16 / 56 page  139036 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.6 — 10 March 2011 139036 16 of 56 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 8.2 SOT1040 specification Table 8. Mechanical properties SOT1040AA1 Package name Outline code Lead frame format Package size Antenna bond pad size SOT1040 SOT1040AA1 single row length: 9 mm 3,0 x 3,0 mm product pitch: 4 mm width: 4 mm metallization: 12 μm Cu substrate: 38 μm PET thickness: max. 250 μm Table 9. Mechanical properties SOT1040AB2 Package name Outline code Lead frame format Package size Antenna bond pad size SOT1040 SOT1040AB2 single row length: 9 mm 3,0 x 3,0 mm product pitch: 4 mm width: 4 mm metallization: 20 μm Al substrate: 38 μm PET thickness: max. 250 μm |
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