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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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MPC8569E Fiches technique(PDF) 123 Page - Freescale Semiconductor, Inc |
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MPC8569E Fiches technique(HTML) 123 Page - Freescale Semiconductor, Inc |
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123 / 127 page  Mechanical Dimensions of the FC-PBGA with Full Lid MPC8569E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1 Freescale Semiconductor 123 4.2 Mechanical Dimensions of the FC-PBGA with Full Lid The following figure shows the mechanical dimensions and bottom surface nomenclature for the MPC8569E FC-PBGA package with full lid. Notes: 1All dimensions are in millimeters. 2Dimensions and tolerances per ASME Y14.5M-1994. 3Maximum solder ball diameter measured parallel to datum A. 4Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 5Parallelism measurement shall exclude any effect of mark on top surface of package. 6All dimensions are symmetric across the package center lines unless dimensioned otherwise. 729.2 mm maximum package assembly (lid and laminate) x and y. Figure 75. MPC8569E FC-PBGA Package with Full Lid |
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