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AD9577BCPZ-R7 Fiches technique(PDF) 16 Page - Analog Devices |
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AD9577BCPZ-R7 Fiches technique(HTML) 16 Page - Analog Devices |
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16 / 44 page ![]() AD9577 Data Sheet Rev. 0 | Page 16 of 44 ABSOLUTE MAXIMUM RATINGS THERMAL CHARACTERISTICS Table 13. Parameter Thermal impedance measurements were taken on a 4-layer board in still air in accordance with EIA/JESD51-7. Rating VS to GND −0.3 V to +3.6 V REFCLK to GND −0.3 V to VS + 0.3 V Table 14. Thermal Resistance Package Type θJA LDO to GND −0.3V to VS + 0.3 V Unit XT1, XT2 to GND −0.3 V to VS + 0.3 V 40-Lead LFCSP 27.5 °C/W −0.3 V to VS + 0.3 V SSCG, MAX_BW, MARGIN, SCL, SDA, REFSEL to GND REFOUT, OUTxP, OUTxN to GND −0.3 V to VS + 0.3 V ESD CAUTION Junction Temperature1 150°C Storage Temperature −65°C to+150°C Lead Temperature (10 sec) 300°C 1 See the Thermal Characteristics section for θJA. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. |
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