IXDF602PI datasheet(11/13 Pages) CLARE

11 / 13 page

IXD_602

R02

www.clare.com

5.4 Mechanical Dimensions

5.4.1 SIA (8-Pin SOIC)

5.4.2 SI (8-Pin Power SOIC with Exposed Metal Back)

Recommended PCB Land Pattern

Dimensions

mm MIN / mm MAX

(inches MIN / inches MAX)

1.30 / 1.75

(0.051 / 0.069)

0.10 / 0.25

(0.004 / 0.010)

4.80 / 5.00

(0.190 / 0.197)

PIN 1

0.31 / 0.51

(0.012 / 0.020)

5.80 / 6.20

(0.228 / 0.244)

3.80 / 4.00

(0.150 / 0.157)

1.27 BSC

(0.05 BSC)

0.40 / 1.27

(0.016 / 0.050)

0.10 / 0.25

(0.004 / 0.010)

0.25 / 0.50 x45º

(0.010 / 0.020 x45º)

0º / 8º

1.27

(0.050)

5.40

(0.213)

1.55

(0.061)

0.60

(0.024)

NOTE: Molded package conforms to JEDEC standard configuration

MS-012 variation AA.

Recommended PCB Land Pattern

Dimensions

mm MIN / mm MAX

(inches MIN / inches MAX)

NOTES:

1. Molded package conforms to JEDEC standard configuration

MS-012 variation BA.

2. The exposed metal pad on the back of the SI package may be

left floating or connected to GND. It is not suitable for carrying

current.

1.30 / 1.75

(0.051 / 0.069)

0.03 / 0.10

(0.001 / 0.004)

4.80 / 5.00

(0.190 / 0.197)

PIN 1

0.31 / 0.51

(0.012 / 0.020)

5.80 / 6.20

(0.228 / 0.244)

3.80 / 4.00

(0.150 / 0.157)

1.27 BSC

(0.05 BSC)

0.40 / 1.27

(0.016 / 0.050)

0.10 / 0.25

(0.004 / 0.010)

0.25 / 0.50 x45º

(0.010 / 0.020 x45º)

0º / 8º

2.29 / 2.79

(0.090 / 0.110)

3.30 / 3.81

(0.130 / 0.150)

1.27

(0.050)

5.40

(0.209)

1.55

(0.061)

0.60

(0.024)

2.75

(0.108)

3.80

(0.150)

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