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MPC8377E Fiches technique(PDF) 89 Page - Freescale Semiconductor, Inc |
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MPC8377E Fiches technique(HTML) 89 Page - Freescale Semiconductor, Inc |
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89 / 126 page ![]() MPC8377E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4 Freescale Semiconductor 89 Package and Pin Listings Figure 63 shows the mechanical dimensions and bottom surface nomenclature of the TEPBGA II package. Figure 63. Mechanical Dimensions and Bottom Surface Nomenclature of the TEPBGA II Note: 1 All dimensions are in millimeters. 2 Dimensioning and tolerancing per ASME Y14. 5M-1994. 3 Maximum solder ball diameter measured parallel to Datum A. 4 Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 5 Parallelism measurement should exclude any effect of mark on top surface of package. |
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