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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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B32632 Fiches technique(PDF) 23 Page - EPCOS |
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B32632 Fiches technique(HTML) 23 Page - EPCOS |
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23 / 29 page  3 Embedding of capacitors in finished assemblies In many applications, finished circuit assemblies are embedded in plastic resins. In this case, both chemical and thermal influences of the embedding ("potting") and curing processes must be taken into account. Our experience has shown that the following potting materials can be recommended: non-flexible epoxy resins with acid-anhydride hardeners; chemically inert, non-conducting fillers; maximum curing temperature of 100 °C. Caution: Consult us first if you wish to embed uncoated types! B32632 ... B32634 Very high pulse (wound) Page 23 of 29 Please read Cautions and warnings and Important notes at the end of this document. |
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