ECLLQFP32EVB datasheet(2/22 Pages) ONSEMI

2 / 22 page

ECLLQFP32EVB

http://onsemi.com

Figure 2. Bottom View of the 32-lead LQFP Evaluation Board

Bottom View

Enlarged Bottom View

Figure 3. Evaluation Board Lay-up

LAY-UP DETAIL

4 LAYER

LAYER 1 (TOP SIDE) 1 OZ

ROGERS 4003 0.008 in

LAYER 2 (GROUND PLANE P1) 1 OZ

FR-4 0.020 in

LAYER 3 (GROUND, VCC & VEE, PLANE P2) 1 OZ

FR-4 0.025 in

LAYER 4 (BOTTOM SIDE) 1 OZ

SILKSCREEN (TOP SIDE)

0.062

$ 0.007

Board Layout

The 32-lead LQFP evaluation board was designed to be

versatile and accommodate several different configurations.

The input, output, and power pin layout of the evaluation

board is shown in Figures 4 and 5. The evaluation board has

at least thirteen possible configurable options. Table 1, list

the devices and the relevant configuration that utilizes this

PCB board. Lists of components and simple schematics are

located in Figures 6 through 18. Place SMA connectors on

J1 through J32, 50

W chip resistors between ground pad and

Pin 1 pad through Pin 32 pad, and chip capacitors C1 through

C5 according to configuration figures. (C4 and C5 are 0.01

mF and C1, C2, and C3 are 0.1 mF); (See Figure 5).

ECLLQFP32EVB Fiches technique(PDF) 2 Page - ON Semiconductor