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CMPWR150SF Fiches technique(PDF) 4 Page - ON Semiconductor |
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CMPWR150SF Fiches technique(HTML) 4 Page - ON Semiconductor |
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4 / 15 page ![]() CMPWR150 Rev. 3 | Page 4 of 15 | www.onsemi.com Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER RATING UNITS ESD Protection (HBM) +2000 V Pin Voltages V CC DRIVE [GND - 0.5] to [+6.0] [GND - 0.5] to [V CC + 0.5] V V Storage Temperature Range -40 to +150 °C Operating Temperature Range Ambient Junction 0 to +70 0 to +125 °C °C Power Dissipation SOIC (see Note 1) 1.0 W Note 1: The SOIC package used is thermally enhanced through the use of a fused integral leadframe. The power rating is based on a printed circuit board heat spreading capability equivalent to 2 square inches of copper connected to the GND pins. Typical multi-layer boards using power plane construction will provide this heat spreading ability without the need for additional dedicated copper area. (Please consult factory for thermal evaluation assistance.) STANDARD OPERATING CONDITIONS PARAMETER RATING UNITS V CC Input Voltage 4.5 to 5.5 V Ambient Operating Temperature Range 0 to +70 °C Load Current 0 to 500 mA C EXT 10 +10% µF |
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