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PCF8563 Fiches technique(PDF) 23 Page - NXP Semiconductors |
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PCF8563 Fiches technique(HTML) 23 Page - NXP Semiconductors |
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23 / 32 page ![]() PCF8563_6 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 06 — 21 February 2008 23 of 32 NXP Semiconductors PCF8563 Real-time clock/calendar 13. Package outline Fig 23. Package outline SOT97-1 (DIP8) REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT97-1 99-12-27 03-02-13 UNIT A max. 12 b1 (1) (1) (1) b2 cD E e M Z H L mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) A min. A max. b max. w M E e 1 1.73 1.14 0.53 0.38 0.36 0.23 9.8 9.2 6.48 6.20 3.60 3.05 0.254 2.54 7.62 8.25 7.80 10.0 8.3 1.15 4.2 0.51 3.2 inches 0.068 0.045 0.021 0.015 0.014 0.009 1.07 0.89 0.042 0.035 0.39 0.36 0.26 0.24 0.14 0.12 0.01 0.1 0.3 0.32 0.31 0.39 0.33 0.045 0.17 0.02 0.13 b2 050G01 MO-001 SC-504-8 MH c (e ) 1 ME A L A1 w M b1 e D A2 Z 8 1 5 4 b E 0 5 10 mm scale Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. pin 1 index DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 |
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