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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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BAS70 Fiches technique(PDF) 17 Page - NXP Semiconductors |
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BAS70 Fiches technique(HTML) 17 Page - NXP Semiconductors |
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17 / 20 page  BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 09 — 13 January 2010 17 of 20 NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes Reflow soldering is the only recommended soldering method. Fig 27. Reflow soldering footprint SOT666 solder lands placement area occupied area solder paste sot666_fr 2.75 2.45 2.1 1.6 0.4 (6 ×) 0.55 (2 ×) 0.25 (2 ×) 0.6 (2 ×) 0.65 (2 ×) 0.3 (2 ×) 0.325 (4 ×) 0.45 (4 ×) 0.5 (4 ×) 0.375 (4 ×) 1.7 2 1.7 1.075 0.538 Dimensions in mm |
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