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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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BAS70 Fiches technique(PDF) 13 Page - NXP Semiconductors |
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BAS70 Fiches technique(HTML) 13 Page - NXP Semiconductors |
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13 / 20 page  BAS70_1PS7XSB70_SER_9 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 09 — 13 January 2010 13 of 20 NXP Semiconductors BAS70 series; 1PS7xSB70 series General-purpose Schottky diodes Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 19. Reflow soldering footprint SOD123F Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 20. Reflow soldering footprint SOD882 1.6 1.6 2.9 4 4.4 1.1 1.2 2.1 1.1 (2 ×) solder lands solder resist occupied area solder paste mbl872 1.30 0.30 R = 0.05 (8 ×) R = 0.05 (8 ×) 0.60 (2 ×) 0.70 (2 ×) 0.80 (2 ×) 0.90 0.30 (2 ×) 0.40 (2 ×) 0.50 (2 ×) solder lands solder resist occupied area solder paste |
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