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Moteur de recherche de fiches techniques de composants électroniques |
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Moteur de recherche de fiches techniques de composants électroniques |
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MPC8379ECVRALFA Fiches technique(PDF) 78 Page - Freescale Semiconductor, Inc |
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MPC8379ECVRALFA Fiches technique(HTML) 78 Page - Freescale Semiconductor, Inc |
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78 / 114 page  MPC8379E PowerQUICC™ II Pro Processor Hardware Specifications, Rev. 2 78 Freescale Semiconductor Package and Pin Listings Figure 60 shows the mechanical dimensions and bottom surface nomenclature of the TEPBGA II package. Figure 60. Mechanical Dimensions and Bottom Surface Nomenclature of the TEPBGA II Note: 1 All dimensions are in millimeters. 2 Dimensioning and tolerancing per ASME Y14. 5M-1994. 3 Maximum solder ball diameter measured parallel to Datum A. 4 Datum A, the seating plane, is determined by the spherical crowns of the solder balls. 5 Parallelism measurement should exclude any effect of mark on top surface of package. 21.2 Pinout Listings Table 68 provides the pin-out listing for the TePBGA II package. Table 68. TePBGA II Pinout Listing Signal Package Pin Number Pin Type Power Supply Notes Clock Signals CLKIN K24 I OVDD — |
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