ADL5380ACPZ-R7 datasheet(34/36 Pages) AD

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ADL5380

Rev. 0 | Page 34 of 36

Figure 99. Low Band Evaluation Board Top Layer

Figure 100. Midband/High Band Evaluation Board Top Layer Silkscreen

Figure 101. Low Band Evaluation Board Bottom Layer

Figure 102. Midband/High Band Evaluation Board Bottom Layer Silkscreen

THERMAL GROUNDING AND EVALUATION

BOARD LAYOUT

The package for the ADL5380 features an exposed paddle on the

underside that should be well soldered to a low thermal and

electrical impedance ground plane. This paddle is typically

soldered to an exposed opening in the solder mask on the

evaluation board. Figure 103 illustrates the dimensions used in

the layout of the ADL5380 footprint on the ADL5380 evaluation

board (1 mil = 0.0254 mm).

Notice the use of nine via holes on the exposed paddle. These

ground vias should be connected to all other ground layers on

the evaluation board to maximize heat dissipation from the

device package.

82 mil.

12 mil.

23 mil.

133.8 mil.

98.4 mil.

19.7 mil.

25 mil.

Figure 103. Dimensions for Evaluation Board Layout for the ADL5380 Package

Under these conditions, the thermal impedance of the ADL5380

was measured to be approximately 30°C/W in still air.

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