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PCA2002CX8/5/1 Fiches technique(PDF) 19 Page - NXP Semiconductors |
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PCA2002CX8/5/1 Fiches technique(HTML) 19 Page - NXP Semiconductors |
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19 / 25 page ![]() PCA2002_5 © NXP B.V. 2008. All rights reserved. Product data sheet Rev. 05 — 11 November 2008 19 of 25 NXP Semiconductors PCA2002 32 kHz watch circuit programmable output period and pulse width 12.2 Unsawn wafer information The die are grouped in arrays of 2 × 6 devices. Each array is edged with a metal path. All this metal paths have to be cut while dicing. Fig 14. Wafer layout of PCA200CX8 Straight edge of the wafer X Y Saw lane ~18 µm(1) ~18 µm(1) 84 µm 84 µm ~18 µm(1) (1) detail X Saw lane 84 µm detail Y 001aai236 18 45 18 45 18 45 18 45 18 45 18 45 18 45 18 45 18 45 18 45 18 45 18 45 |
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