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M24M01-R Fiches technique(PDF) 29 Page - STMicroelectronics

No de pièce M24M01-R
Description  1 Mbit serial I²C bus EEPROM
PDF  36 Pages
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Fabricant  STMICROELECTRONICS [STMicroelectronics]
Site Internet  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

M24M01-R Fiches technique(HTML) 29 Page - STMicroelectronics

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M24M01-R, M24M01-W, M24M01-HR
M24M01-R die description
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M24M01-R die description
Caution:
As EEPROM cells loose their charge (and so their binary value) when exposed to ultra violet
(UV) light, EEPROM dice delivered in wafer form by STMicroelectronics must never be
exposed to UV light.
Product
M24M01-A
Wafer size
203 mm (8 inches)
Die identification
M24M01, processed in the Rousset fab
Die Layout
Die size (X × Y)
2085 × 3605 µm (including scribe line)
Scribe line
80.0 × 80.0 µm
Pad opening
90 × 90 µm
DI
Die identification (at the position shown in Figure 15)
Pads
Pad contacts (at the positions shown in Figure 15 and
Table 17)
Figure 15.
M24M01-R die plot
1.
Refer to Table 17: Pad coordinates for the pad locations.
Die identification: M24M01
VCC
WC
SCL
SDA
E1
E2
VSS
E0
Y
X
ai15446



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