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M41ST84W Fiches technique(PDF) 31 Page - STMicroelectronics |
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M41ST84W Fiches technique(HTML) 31 Page - STMicroelectronics |
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31 / 34 page ![]() M41ST84W Package mechanical data 31/34 6 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 19. SO16 – 16-lead plastic small outline, package outline Note: Drawing is not to scale. Table 15. SO16 – 16-lead plastic small outline, package mechanical data SO-b E N CP B e A2 D C L A1 H A 1 Symbol mm inches Typ. Min. Max. Typ. Min. Max. A 1.75 0.069 A1 0.10 0.25 0.004 0.010 A2 1.60 0.063 B 0.35 0.46 0.014 0.018 C 0.19 0.25 0.007 0.010 D 9.80 10.00 0.386 0.394 E 3.80 4.00 0.150 0.158 e1.27 – – 0.050 – – H 5.80 6.20 0.228 0.244 L 0.40 1.27 0.016 0.050 a 0°8° 0°8° N16 16 CP 0.10 0.004 |
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